Kconfig 12 KB

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  1. #
  2. # Generic thermal sysfs drivers configuration
  3. #
  4. menuconfig THERMAL
  5. tristate "Generic Thermal sysfs driver"
  6. help
  7. Generic Thermal Sysfs driver offers a generic mechanism for
  8. thermal management. Usually it's made up of one or more thermal
  9. zone and cooling device.
  10. Each thermal zone contains its own temperature, trip points,
  11. cooling devices.
  12. All platforms with ACPI thermal support can use this driver.
  13. If you want this support, you should say Y or M here.
  14. if THERMAL
  15. config THERMAL_HWMON
  16. bool
  17. prompt "Expose thermal sensors as hwmon device"
  18. depends on HWMON=y || HWMON=THERMAL
  19. default y
  20. help
  21. In case a sensor is registered with the thermal
  22. framework, this option will also register it
  23. as a hwmon. The sensor will then have the common
  24. hwmon sysfs interface.
  25. Say 'Y' here if you want all thermal sensors to
  26. have hwmon sysfs interface too.
  27. config THERMAL_OF
  28. bool
  29. prompt "APIs to parse thermal data out of device tree"
  30. depends on OF
  31. default y
  32. help
  33. This options provides helpers to add the support to
  34. read and parse thermal data definitions out of the
  35. device tree blob.
  36. Say 'Y' here if you need to build thermal infrastructure
  37. based on device tree.
  38. config THERMAL_WRITABLE_TRIPS
  39. bool "Enable writable trip points"
  40. help
  41. This option allows the system integrator to choose whether
  42. trip temperatures can be changed from userspace. The
  43. writable trips need to be specified when setting up the
  44. thermal zone but the choice here takes precedence.
  45. Say 'Y' here if you would like to allow userspace tools to
  46. change trip temperatures.
  47. choice
  48. prompt "Default Thermal governor"
  49. default THERMAL_DEFAULT_GOV_STEP_WISE
  50. help
  51. This option sets which thermal governor shall be loaded at
  52. startup. If in doubt, select 'step_wise'.
  53. config THERMAL_DEFAULT_GOV_STEP_WISE
  54. bool "step_wise"
  55. select THERMAL_GOV_STEP_WISE
  56. help
  57. Use the step_wise governor as default. This throttles the
  58. devices one step at a time.
  59. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  60. bool "fair_share"
  61. select THERMAL_GOV_FAIR_SHARE
  62. help
  63. Use the fair_share governor as default. This throttles the
  64. devices based on their 'contribution' to a zone. The
  65. contribution should be provided through platform data.
  66. config THERMAL_DEFAULT_GOV_USER_SPACE
  67. bool "user_space"
  68. select THERMAL_GOV_USER_SPACE
  69. help
  70. Select this if you want to let the user space manage the
  71. platform thermals.
  72. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  73. bool "power_allocator"
  74. select THERMAL_GOV_POWER_ALLOCATOR
  75. help
  76. Select this if you want to control temperature based on
  77. system and device power allocation. This governor can only
  78. operate on cooling devices that implement the power API.
  79. endchoice
  80. config THERMAL_GOV_FAIR_SHARE
  81. bool "Fair-share thermal governor"
  82. help
  83. Enable this to manage platform thermals using fair-share governor.
  84. config THERMAL_GOV_STEP_WISE
  85. bool "Step_wise thermal governor"
  86. help
  87. Enable this to manage platform thermals using a simple linear
  88. governor.
  89. config THERMAL_GOV_BANG_BANG
  90. bool "Bang Bang thermal governor"
  91. default n
  92. help
  93. Enable this to manage platform thermals using bang bang governor.
  94. Say 'Y' here if you want to use two point temperature regulation
  95. used for fans without throttling. Some fan drivers depend on this
  96. governor to be enabled (e.g. acerhdf).
  97. config THERMAL_GOV_USER_SPACE
  98. bool "User_space thermal governor"
  99. help
  100. Enable this to let the user space manage the platform thermals.
  101. config THERMAL_GOV_POWER_ALLOCATOR
  102. bool "Power allocator thermal governor"
  103. help
  104. Enable this to manage platform thermals by dynamically
  105. allocating and limiting power to devices.
  106. config CPU_THERMAL
  107. bool "generic cpu cooling support"
  108. depends on CPU_FREQ
  109. depends on THERMAL_OF
  110. help
  111. This implements the generic cpu cooling mechanism through frequency
  112. reduction. An ACPI version of this already exists
  113. (drivers/acpi/processor_thermal.c).
  114. This will be useful for platforms using the generic thermal interface
  115. and not the ACPI interface.
  116. If you want this support, you should say Y here.
  117. config CLOCK_THERMAL
  118. bool "Generic clock cooling support"
  119. depends on COMMON_CLK
  120. depends on PM_OPP
  121. help
  122. This entry implements the generic clock cooling mechanism through
  123. frequency clipping. Typically used to cool off co-processors. The
  124. device that is configured to use this cooling mechanism will be
  125. controlled to reduce clock frequency whenever temperature is high.
  126. If you want this support, you should say Y here.
  127. config THERMAL_EMULATION
  128. bool "Thermal emulation mode support"
  129. help
  130. Enable this option to make a emul_temp sysfs node in thermal zone
  131. directory to support temperature emulation. With emulation sysfs node,
  132. user can manually input temperature and test the different trip
  133. threshold behaviour for simulation purpose.
  134. WARNING: Be careful while enabling this option on production systems,
  135. because userland can easily disable the thermal policy by simply
  136. flooding this sysfs node with low temperature values.
  137. config HISI_THERMAL
  138. tristate "Hisilicon thermal driver"
  139. depends on ARCH_HISI && CPU_THERMAL && OF
  140. help
  141. Enable this to plug hisilicon's thermal sensor driver into the Linux
  142. thermal framework. cpufreq is used as the cooling device to throttle
  143. CPUs when the passive trip is crossed.
  144. config IMX_THERMAL
  145. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  146. depends on CPU_THERMAL
  147. depends on MFD_SYSCON
  148. depends on OF
  149. help
  150. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  151. It supports one critical trip point and one passive trip point. The
  152. cpufreq is used as the cooling device to throttle CPUs when the
  153. passive trip is crossed.
  154. config SPEAR_THERMAL
  155. bool "SPEAr thermal sensor driver"
  156. depends on PLAT_SPEAR
  157. depends on OF
  158. help
  159. Enable this to plug the SPEAr thermal sensor driver into the Linux
  160. thermal framework.
  161. config ROCKCHIP_THERMAL
  162. tristate "Rockchip thermal driver"
  163. depends on ARCH_ROCKCHIP
  164. depends on RESET_CONTROLLER
  165. help
  166. Rockchip thermal driver provides support for Temperature sensor
  167. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  168. trip point. Cpufreq is used as the cooling device and will throttle
  169. CPUs when the Temperature crosses the passive trip point.
  170. config RCAR_THERMAL
  171. tristate "Renesas R-Car thermal driver"
  172. depends on ARCH_SHMOBILE || COMPILE_TEST
  173. depends on HAS_IOMEM
  174. help
  175. Enable this to plug the R-Car thermal sensor driver into the Linux
  176. thermal framework.
  177. config KIRKWOOD_THERMAL
  178. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  179. depends on MACH_KIRKWOOD
  180. depends on OF
  181. help
  182. Support for the Kirkwood thermal sensor driver into the Linux thermal
  183. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  184. config DOVE_THERMAL
  185. tristate "Temperature sensor on Marvell Dove SoCs"
  186. depends on ARCH_DOVE || MACH_DOVE
  187. depends on OF
  188. help
  189. Support for the Dove thermal sensor driver in the Linux thermal
  190. framework.
  191. config DB8500_THERMAL
  192. bool "DB8500 thermal management"
  193. depends on ARCH_U8500
  194. default y
  195. help
  196. Adds DB8500 thermal management implementation according to the thermal
  197. management framework. A thermal zone with several trip points will be
  198. created. Cooling devices can be bound to the trip points to cool this
  199. thermal zone if trip points reached.
  200. config ARMADA_THERMAL
  201. tristate "Armada 370/XP thermal management"
  202. depends on ARCH_MVEBU
  203. depends on OF
  204. help
  205. Enable this option if you want to have support for thermal management
  206. controller present in Armada 370 and Armada XP SoC.
  207. config TEGRA_SOCTHERM
  208. tristate "Tegra SOCTHERM thermal management"
  209. depends on ARCH_TEGRA
  210. help
  211. Enable this option for integrated thermal management support on NVIDIA
  212. Tegra124 systems-on-chip. The driver supports four thermal zones
  213. (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
  214. zones to manage temperatures. This option is also required for the
  215. emergency thermal reset (thermtrip) feature to function.
  216. config DB8500_CPUFREQ_COOLING
  217. tristate "DB8500 cpufreq cooling"
  218. depends on ARCH_U8500
  219. depends on CPU_THERMAL
  220. default y
  221. help
  222. Adds DB8500 cpufreq cooling devices, and these cooling devices can be
  223. bound to thermal zone trip points. When a trip point reached, the
  224. bound cpufreq cooling device turns active to set CPU frequency low to
  225. cool down the CPU.
  226. config INTEL_POWERCLAMP
  227. tristate "Intel PowerClamp idle injection driver"
  228. depends on THERMAL
  229. depends on X86
  230. depends on CPU_SUP_INTEL
  231. help
  232. Enable this to enable Intel PowerClamp idle injection driver. This
  233. enforce idle time which results in more package C-state residency. The
  234. user interface is exposed via generic thermal framework.
  235. config X86_PKG_TEMP_THERMAL
  236. tristate "X86 package temperature thermal driver"
  237. depends on X86_THERMAL_VECTOR
  238. select THERMAL_GOV_USER_SPACE
  239. default m
  240. help
  241. Enable this to register CPU digital sensor for package temperature as
  242. thermal zone. Each package will have its own thermal zone. There are
  243. two trip points which can be set by user to get notifications via thermal
  244. notification methods.
  245. config INTEL_SOC_DTS_IOSF_CORE
  246. tristate
  247. depends on X86
  248. select IOSF_MBI
  249. help
  250. This is becoming a common feature for Intel SoCs to expose the additional
  251. digital temperature sensors (DTSs) using side band interface (IOSF). This
  252. implements the common set of helper functions to register, get temperature
  253. and get/set thresholds on DTSs.
  254. config INTEL_SOC_DTS_THERMAL
  255. tristate "Intel SoCs DTS thermal driver"
  256. depends on X86
  257. select INTEL_SOC_DTS_IOSF_CORE
  258. help
  259. Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
  260. temperature sensor (DTS). These SoCs have two additional DTSs in
  261. addition to DTSs on CPU cores. Each DTS will be registered as a
  262. thermal zone. There are two trip points. One of the trip point can
  263. be set by user mode programs to get notifications via Linux thermal
  264. notification methods.The other trip is a critical trip point, which
  265. was set by the driver based on the TJ MAX temperature.
  266. config INTEL_QUARK_DTS_THERMAL
  267. tristate "Intel Quark DTS thermal driver"
  268. depends on X86_INTEL_QUARK
  269. help
  270. Enable this to register Intel Quark SoC (e.g. X1000) platform digital
  271. temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
  272. The DTS will be registered as a thermal zone. There are two trip points:
  273. hot & critical. The critical trip point default value is set by
  274. underlying BIOS/Firmware.
  275. config INT340X_THERMAL
  276. tristate "ACPI INT340X thermal drivers"
  277. depends on X86 && ACPI
  278. select THERMAL_GOV_USER_SPACE
  279. select ACPI_THERMAL_REL
  280. select ACPI_FAN
  281. select INTEL_SOC_DTS_IOSF_CORE
  282. help
  283. Newer laptops and tablets that use ACPI may have thermal sensors and
  284. other devices with thermal control capabilities outside the core
  285. CPU/SOC, for thermal safety reasons.
  286. They are exposed for the OS to use via the INT3400 ACPI device object
  287. as the master, and INT3401~INT340B ACPI device objects as the slaves.
  288. Enable this to expose the temperature information and cooling ability
  289. from these objects to userspace via the normal thermal framework.
  290. This means that a wide range of applications and GUI widgets can show
  291. the information to the user or use this information for making
  292. decisions. For example, the Intel Thermal Daemon can use this
  293. information to allow the user to select his laptop to run without
  294. turning on the fans.
  295. config ACPI_THERMAL_REL
  296. tristate
  297. depends on ACPI
  298. menu "Texas Instruments thermal drivers"
  299. source "drivers/thermal/ti-soc-thermal/Kconfig"
  300. endmenu
  301. menu "Samsung thermal drivers"
  302. depends on ARCH_EXYNOS
  303. source "drivers/thermal/samsung/Kconfig"
  304. endmenu
  305. menu "STMicroelectronics thermal drivers"
  306. depends on ARCH_STI && OF
  307. source "drivers/thermal/st/Kconfig"
  308. endmenu
  309. config QCOM_SPMI_TEMP_ALARM
  310. tristate "Qualcomm SPMI PMIC Temperature Alarm"
  311. depends on OF && SPMI && IIO
  312. select REGMAP_SPMI
  313. help
  314. This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
  315. PMIC devices. It shows up in sysfs as a thermal sensor with multiple
  316. trip points. The temperature reported by the thermal sensor reflects the
  317. real time die temperature if an ADC is present or an estimate of the
  318. temperature based upon the over temperature stage value.
  319. endif