Kconfig 16 KB

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  1. #
  2. # Generic thermal sysfs drivers configuration
  3. #
  4. menuconfig THERMAL
  5. tristate "Generic Thermal sysfs driver"
  6. help
  7. Generic Thermal Sysfs driver offers a generic mechanism for
  8. thermal management. Usually it's made up of one or more thermal
  9. zone and cooling device.
  10. Each thermal zone contains its own temperature, trip points,
  11. cooling devices.
  12. All platforms with ACPI thermal support can use this driver.
  13. If you want this support, you should say Y or M here.
  14. if THERMAL
  15. config THERMAL_STATISTICS
  16. bool "Thermal state transition statistics"
  17. help
  18. Export thermal state transition statistics information through sysfs.
  19. If in doubt, say N.
  20. config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
  21. int "Emergency poweroff delay in milli-seconds"
  22. depends on THERMAL
  23. default 0
  24. help
  25. Thermal subsystem will issue a graceful shutdown when
  26. critical temperatures are reached using orderly_poweroff(). In
  27. case of failure of an orderly_poweroff(), the thermal emergency
  28. poweroff kicks in after a delay has elapsed and shuts down the system.
  29. This config is number of milliseconds to delay before emergency
  30. poweroff kicks in. Similarly to the critical trip point,
  31. the delay should be carefully profiled so as to give adequate
  32. time for orderly_poweroff() to finish on regular execution.
  33. If set to 0 emergency poweroff will not be supported.
  34. In doubt, leave as 0.
  35. config THERMAL_HWMON
  36. bool
  37. prompt "Expose thermal sensors as hwmon device"
  38. depends on HWMON=y || HWMON=THERMAL
  39. default y
  40. help
  41. In case a sensor is registered with the thermal
  42. framework, this option will also register it
  43. as a hwmon. The sensor will then have the common
  44. hwmon sysfs interface.
  45. Say 'Y' here if you want all thermal sensors to
  46. have hwmon sysfs interface too.
  47. config THERMAL_OF
  48. bool
  49. prompt "APIs to parse thermal data out of device tree"
  50. depends on OF
  51. default y
  52. help
  53. This options provides helpers to add the support to
  54. read and parse thermal data definitions out of the
  55. device tree blob.
  56. Say 'Y' here if you need to build thermal infrastructure
  57. based on device tree.
  58. config THERMAL_WRITABLE_TRIPS
  59. bool "Enable writable trip points"
  60. help
  61. This option allows the system integrator to choose whether
  62. trip temperatures can be changed from userspace. The
  63. writable trips need to be specified when setting up the
  64. thermal zone but the choice here takes precedence.
  65. Say 'Y' here if you would like to allow userspace tools to
  66. change trip temperatures.
  67. choice
  68. prompt "Default Thermal governor"
  69. default THERMAL_DEFAULT_GOV_STEP_WISE
  70. help
  71. This option sets which thermal governor shall be loaded at
  72. startup. If in doubt, select 'step_wise'.
  73. config THERMAL_DEFAULT_GOV_STEP_WISE
  74. bool "step_wise"
  75. select THERMAL_GOV_STEP_WISE
  76. help
  77. Use the step_wise governor as default. This throttles the
  78. devices one step at a time.
  79. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  80. bool "fair_share"
  81. select THERMAL_GOV_FAIR_SHARE
  82. help
  83. Use the fair_share governor as default. This throttles the
  84. devices based on their 'contribution' to a zone. The
  85. contribution should be provided through platform data.
  86. config THERMAL_DEFAULT_GOV_USER_SPACE
  87. bool "user_space"
  88. select THERMAL_GOV_USER_SPACE
  89. help
  90. Select this if you want to let the user space manage the
  91. platform thermals.
  92. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  93. bool "power_allocator"
  94. select THERMAL_GOV_POWER_ALLOCATOR
  95. help
  96. Select this if you want to control temperature based on
  97. system and device power allocation. This governor can only
  98. operate on cooling devices that implement the power API.
  99. endchoice
  100. config THERMAL_GOV_FAIR_SHARE
  101. bool "Fair-share thermal governor"
  102. help
  103. Enable this to manage platform thermals using fair-share governor.
  104. config THERMAL_GOV_STEP_WISE
  105. bool "Step_wise thermal governor"
  106. help
  107. Enable this to manage platform thermals using a simple linear
  108. governor.
  109. config THERMAL_GOV_BANG_BANG
  110. bool "Bang Bang thermal governor"
  111. default n
  112. help
  113. Enable this to manage platform thermals using bang bang governor.
  114. Say 'Y' here if you want to use two point temperature regulation
  115. used for fans without throttling. Some fan drivers depend on this
  116. governor to be enabled (e.g. acerhdf).
  117. config THERMAL_GOV_USER_SPACE
  118. bool "User_space thermal governor"
  119. help
  120. Enable this to let the user space manage the platform thermals.
  121. config THERMAL_GOV_POWER_ALLOCATOR
  122. bool "Power allocator thermal governor"
  123. help
  124. Enable this to manage platform thermals by dynamically
  125. allocating and limiting power to devices.
  126. config CPU_THERMAL
  127. bool "generic cpu cooling support"
  128. depends on CPU_FREQ
  129. depends on THERMAL_OF
  130. help
  131. This implements the generic cpu cooling mechanism through frequency
  132. reduction. An ACPI version of this already exists
  133. (drivers/acpi/processor_thermal.c).
  134. This will be useful for platforms using the generic thermal interface
  135. and not the ACPI interface.
  136. If you want this support, you should say Y here.
  137. config CLOCK_THERMAL
  138. bool "Generic clock cooling support"
  139. depends on COMMON_CLK
  140. depends on PM_OPP
  141. help
  142. This entry implements the generic clock cooling mechanism through
  143. frequency clipping. Typically used to cool off co-processors. The
  144. device that is configured to use this cooling mechanism will be
  145. controlled to reduce clock frequency whenever temperature is high.
  146. config DEVFREQ_THERMAL
  147. bool "Generic device cooling support"
  148. depends on PM_DEVFREQ
  149. depends on PM_OPP
  150. help
  151. This implements the generic devfreq cooling mechanism through
  152. frequency reduction for devices using devfreq.
  153. This will throttle the device by limiting the maximum allowed DVFS
  154. frequency corresponding to the cooling level.
  155. In order to use the power extensions of the cooling device,
  156. devfreq should use the simple_ondemand governor.
  157. If you want this support, you should say Y here.
  158. config THERMAL_EMULATION
  159. bool "Thermal emulation mode support"
  160. help
  161. Enable this option to make a emul_temp sysfs node in thermal zone
  162. directory to support temperature emulation. With emulation sysfs node,
  163. user can manually input temperature and test the different trip
  164. threshold behaviour for simulation purpose.
  165. WARNING: Be careful while enabling this option on production systems,
  166. because userland can easily disable the thermal policy by simply
  167. flooding this sysfs node with low temperature values.
  168. config HISI_THERMAL
  169. tristate "Hisilicon thermal driver"
  170. depends on ARCH_HISI || COMPILE_TEST
  171. depends on HAS_IOMEM
  172. depends on OF
  173. default y
  174. help
  175. Enable this to plug hisilicon's thermal sensor driver into the Linux
  176. thermal framework. cpufreq is used as the cooling device to throttle
  177. CPUs when the passive trip is crossed.
  178. config IMX_THERMAL
  179. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  180. depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
  181. depends on NVMEM || !NVMEM
  182. depends on MFD_SYSCON
  183. depends on OF
  184. help
  185. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  186. It supports one critical trip point and one passive trip point. The
  187. cpufreq is used as the cooling device to throttle CPUs when the
  188. passive trip is crossed.
  189. config MAX77620_THERMAL
  190. tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
  191. depends on MFD_MAX77620
  192. depends on OF
  193. help
  194. Support for die junction temperature warning alarm for Maxim
  195. Semiconductor PMIC MAX77620 device. Device generates two alarm
  196. interrupts when PMIC die temperature cross the threshold of
  197. 120 degC and 140 degC.
  198. config QORIQ_THERMAL
  199. tristate "QorIQ Thermal Monitoring Unit"
  200. depends on THERMAL_OF
  201. depends on HAS_IOMEM
  202. help
  203. Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
  204. It supports one critical trip point and one passive trip point. The
  205. cpufreq is used as the cooling device to throttle CPUs when the
  206. passive trip is crossed.
  207. config SPEAR_THERMAL
  208. tristate "SPEAr thermal sensor driver"
  209. depends on PLAT_SPEAR || COMPILE_TEST
  210. depends on HAS_IOMEM
  211. depends on OF
  212. help
  213. Enable this to plug the SPEAr thermal sensor driver into the Linux
  214. thermal framework.
  215. config ROCKCHIP_THERMAL
  216. tristate "Rockchip thermal driver"
  217. depends on ARCH_ROCKCHIP || COMPILE_TEST
  218. depends on RESET_CONTROLLER
  219. depends on HAS_IOMEM
  220. help
  221. Rockchip thermal driver provides support for Temperature sensor
  222. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  223. trip point. Cpufreq is used as the cooling device and will throttle
  224. CPUs when the Temperature crosses the passive trip point.
  225. config RCAR_THERMAL
  226. tristate "Renesas R-Car thermal driver"
  227. depends on ARCH_RENESAS || COMPILE_TEST
  228. depends on HAS_IOMEM
  229. help
  230. Enable this to plug the R-Car thermal sensor driver into the Linux
  231. thermal framework.
  232. config RCAR_GEN3_THERMAL
  233. tristate "Renesas R-Car Gen3 thermal driver"
  234. depends on ARCH_RENESAS || COMPILE_TEST
  235. depends on HAS_IOMEM
  236. depends on OF
  237. help
  238. Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
  239. thermal framework.
  240. config KIRKWOOD_THERMAL
  241. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  242. depends on MACH_KIRKWOOD || COMPILE_TEST
  243. depends on HAS_IOMEM
  244. depends on OF
  245. help
  246. Support for the Kirkwood thermal sensor driver into the Linux thermal
  247. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  248. config DOVE_THERMAL
  249. tristate "Temperature sensor on Marvell Dove SoCs"
  250. depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
  251. depends on HAS_IOMEM
  252. depends on OF
  253. help
  254. Support for the Dove thermal sensor driver in the Linux thermal
  255. framework.
  256. config DB8500_THERMAL
  257. tristate "DB8500 thermal management"
  258. depends on MFD_DB8500_PRCMU
  259. default y
  260. help
  261. Adds DB8500 thermal management implementation according to the thermal
  262. management framework. A thermal zone with several trip points will be
  263. created. Cooling devices can be bound to the trip points to cool this
  264. thermal zone if trip points reached.
  265. config ARMADA_THERMAL
  266. tristate "Marvell EBU Armada SoCs thermal management"
  267. depends on ARCH_MVEBU || COMPILE_TEST
  268. depends on HAS_IOMEM
  269. depends on OF
  270. help
  271. Enable this option if you want to have support for thermal management
  272. controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
  273. config DA9062_THERMAL
  274. tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
  275. depends on MFD_DA9062 || COMPILE_TEST
  276. depends on OF
  277. help
  278. Enable this for the Dialog Semiconductor thermal sensor driver.
  279. This will report PMIC junction over-temperature for one thermal trip
  280. zone.
  281. Compatible with the DA9062 and DA9061 PMICs.
  282. config INTEL_POWERCLAMP
  283. tristate "Intel PowerClamp idle injection driver"
  284. depends on THERMAL
  285. depends on X86
  286. depends on CPU_SUP_INTEL
  287. help
  288. Enable this to enable Intel PowerClamp idle injection driver. This
  289. enforce idle time which results in more package C-state residency. The
  290. user interface is exposed via generic thermal framework.
  291. config X86_PKG_TEMP_THERMAL
  292. tristate "X86 package temperature thermal driver"
  293. depends on X86_THERMAL_VECTOR
  294. select THERMAL_GOV_USER_SPACE
  295. select THERMAL_WRITABLE_TRIPS
  296. default m
  297. help
  298. Enable this to register CPU digital sensor for package temperature as
  299. thermal zone. Each package will have its own thermal zone. There are
  300. two trip points which can be set by user to get notifications via thermal
  301. notification methods.
  302. config INTEL_SOC_DTS_IOSF_CORE
  303. tristate
  304. depends on X86 && PCI
  305. select IOSF_MBI
  306. help
  307. This is becoming a common feature for Intel SoCs to expose the additional
  308. digital temperature sensors (DTSs) using side band interface (IOSF). This
  309. implements the common set of helper functions to register, get temperature
  310. and get/set thresholds on DTSs.
  311. config INTEL_SOC_DTS_THERMAL
  312. tristate "Intel SoCs DTS thermal driver"
  313. depends on X86 && PCI && ACPI
  314. select INTEL_SOC_DTS_IOSF_CORE
  315. select THERMAL_WRITABLE_TRIPS
  316. help
  317. Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
  318. temperature sensor (DTS). These SoCs have two additional DTSs in
  319. addition to DTSs on CPU cores. Each DTS will be registered as a
  320. thermal zone. There are two trip points. One of the trip point can
  321. be set by user mode programs to get notifications via Linux thermal
  322. notification methods.The other trip is a critical trip point, which
  323. was set by the driver based on the TJ MAX temperature.
  324. config INTEL_QUARK_DTS_THERMAL
  325. tristate "Intel Quark DTS thermal driver"
  326. depends on X86_INTEL_QUARK
  327. help
  328. Enable this to register Intel Quark SoC (e.g. X1000) platform digital
  329. temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
  330. The DTS will be registered as a thermal zone. There are two trip points:
  331. hot & critical. The critical trip point default value is set by
  332. underlying BIOS/Firmware.
  333. menu "ACPI INT340X thermal drivers"
  334. source drivers/thermal/int340x_thermal/Kconfig
  335. endmenu
  336. config INTEL_BXT_PMIC_THERMAL
  337. tristate "Intel Broxton PMIC thermal driver"
  338. depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP
  339. help
  340. Select this driver for Intel Broxton PMIC with ADC channels monitoring
  341. system temperature measurements and alerts.
  342. This driver is used for monitoring the ADC channels of PMIC and handles
  343. the alert trip point interrupts and notifies the thermal framework with
  344. the trip point and temperature details of the zone.
  345. config INTEL_PCH_THERMAL
  346. tristate "Intel PCH Thermal Reporting Driver"
  347. depends on X86 && PCI
  348. help
  349. Enable this to support thermal reporting on certain intel PCHs.
  350. Thermal reporting device will provide temperature reading,
  351. programmable trip points and other information.
  352. config MTK_THERMAL
  353. tristate "Temperature sensor driver for mediatek SoCs"
  354. depends on ARCH_MEDIATEK || COMPILE_TEST
  355. depends on HAS_IOMEM
  356. depends on NVMEM || NVMEM=n
  357. depends on RESET_CONTROLLER
  358. default y
  359. help
  360. Enable this option if you want to have support for thermal management
  361. controller present in Mediatek SoCs
  362. menu "Broadcom thermal drivers"
  363. depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || COMPILE_TEST
  364. source "drivers/thermal/broadcom/Kconfig"
  365. endmenu
  366. menu "Texas Instruments thermal drivers"
  367. depends on ARCH_HAS_BANDGAP || COMPILE_TEST
  368. depends on HAS_IOMEM
  369. source "drivers/thermal/ti-soc-thermal/Kconfig"
  370. endmenu
  371. menu "Samsung thermal drivers"
  372. depends on ARCH_EXYNOS || COMPILE_TEST
  373. source "drivers/thermal/samsung/Kconfig"
  374. endmenu
  375. menu "STMicroelectronics thermal drivers"
  376. depends on ARCH_STI && OF
  377. source "drivers/thermal/st/Kconfig"
  378. endmenu
  379. config TANGO_THERMAL
  380. tristate "Tango thermal management"
  381. depends on ARCH_TANGO || COMPILE_TEST
  382. help
  383. Enable the Tango thermal driver, which supports the primitive
  384. temperature sensor embedded in Tango chips since the SMP8758.
  385. This sensor only generates a 1-bit signal to indicate whether
  386. the die temperature exceeds a programmable threshold.
  387. source "drivers/thermal/tegra/Kconfig"
  388. config QCOM_SPMI_TEMP_ALARM
  389. tristate "Qualcomm SPMI PMIC Temperature Alarm"
  390. depends on OF && SPMI && IIO
  391. select REGMAP_SPMI
  392. help
  393. This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
  394. PMIC devices. It shows up in sysfs as a thermal sensor with multiple
  395. trip points. The temperature reported by the thermal sensor reflects the
  396. real time die temperature if an ADC is present or an estimate of the
  397. temperature based upon the over temperature stage value.
  398. config GENERIC_ADC_THERMAL
  399. tristate "Generic ADC based thermal sensor"
  400. depends on IIO
  401. help
  402. This enabled a thermal sysfs driver for the temperature sensor
  403. which is connected to the General Purpose ADC. The ADC channel
  404. is read via IIO framework and the channel information is provided
  405. to this driver. This driver reports the temperature by reading ADC
  406. channel and converts it to temperature based on lookup table.
  407. menu "Qualcomm thermal drivers"
  408. depends on (ARCH_QCOM && OF) || COMPILE_TEST
  409. source "drivers/thermal/qcom/Kconfig"
  410. endmenu
  411. config ZX2967_THERMAL
  412. tristate "Thermal sensors on zx2967 SoC"
  413. depends on ARCH_ZX || COMPILE_TEST
  414. help
  415. Enable the zx2967 thermal sensors driver, which supports
  416. the primitive temperature sensor embedded in zx2967 SoCs.
  417. This sensor generates the real time die temperature.
  418. config UNIPHIER_THERMAL
  419. tristate "Socionext UniPhier thermal driver"
  420. depends on ARCH_UNIPHIER || COMPILE_TEST
  421. depends on THERMAL_OF && MFD_SYSCON
  422. help
  423. Enable this to plug in UniPhier on-chip PVT thermal driver into the
  424. thermal framework. The driver supports CPU thermal zone temperature
  425. reporting and a couple of trip points.
  426. endif