Neo900/MANUFACTURING.md

BOARDS

• UPPER board

  • 0.8mm thickness
  • 8 layers (not for v2 prototype)
  • HDI
    

• LOWER and BoB

  • 0.8mm thickness
  • 6 layers
  • (probably) no HDI

TRACKS

• Ordinary (non-power and not necked for BGAs) tracks
  • 6 mil tracks / 6 mil separation (around 1.5 mm)
    

SOLDERING

• Vapour-phase reflow soldering