Microphones placed on S2 (upper surface of LOWER board) will face a case rather than a spacerframe similar to a sim card holder on the picture below (http://neo900.org/stuff/papers/simsw.pdf).
Design however assumed that they will face a non-vanila custom-crafted spacerframe (which is also depicted).
This will make orifice drilling required.
Maybe there are other options?
Microphones placed on S2 (upper surface of LOWER board) will face a case rather than a spacerframe similar to a sim card holder on the picture below (http://neo900.org/stuff/papers/simsw.pdf).
Design however assumed that they will face a non-vanila custom-crafted spacerframe (which is also depicted).
This will make orifice drilling required.
Maybe there are other options?
Microphones placed on S2 (upper surface of LOWER board) will face a case rather than a spacerframe similar to a sim card holder on the picture below (http://neo900.org/stuff/papers/simsw.pdf).
Design however assumed that they will face a non-vanila custom-crafted spacerframe (which is also depicted).
This will make orifice drilling required. Maybe there are other options?