#670 [Docs] RAM module buying guide based on JEDEC specs

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opened 3 weeks ago by swiftgeek · 0 comments
  • Most sticks use boards published on JEDEC site
  • Board type and revision can be read from (almost) every sticker, as such labeling is standardized by JEDEC as well
  • TS-on-DIMM is available only on some modules, eg. on DDR2 only some SODIMM have /EVENT connected at all and while almost all DDR3 SODIMM modules seem to have /EVENT connected, only some have pads for mounting thermal sensor separately to SPD EEPROM
  • It should be possible to say what cards (in what revisions) will work on what machines - eg. There shouldn't be any issue when mounting F1, F2 or F3 4GiB PC3(L) stick in a montevina device.
    • Samsung, elpida often lies about used card design, making changes that they deem insignificant - eg. removing MSOP8 pads making it harder to install TS
  • It should be possible to tell what card has thermal sensor from its pictures and labeling - "EEPROM-only" chip will be mounted only on one of the sides when pads for separate TS are available.

TODO:

  • Figure out how to refer to reference PCB itself, for sake of consistency in docs: card/board/module version and revision
  • Something in javascript I guess to decode label (in addition to static page explaining format)
  • Make pictures of recommended cards, so if vendor changes PCB, there is something to compare against
* Most sticks use boards published on JEDEC site * Board type and revision can be read from (almost) every sticker, as such labeling is standardized by JEDEC as well * TS-on-DIMM is available only on some modules, eg. on DDR2 only some SODIMM have /EVENT connected at all and while almost all DDR3 SODIMM modules seem to have /EVENT connected, only some have pads for mounting thermal sensor separately to SPD EEPROM * It should be possible to say what cards (in what revisions) will work on what machines - eg. There shouldn't be any issue when mounting F1, F2 or F3 4GiB PC3(L) stick in a montevina device. * Samsung, elpida often lies about used card design, making changes that they deem insignificant - eg. removing MSOP8 pads making it harder to install TS * It should be possible to tell what card has thermal sensor from its pictures and labeling - "EEPROM-only" chip will be mounted only on one of the sides when pads for separate TS are available. TODO: * Figure out how to refer to reference PCB itself, for sake of consistency in docs: card/board/module version and revision * Something in javascript I guess to decode label (in addition to static page explaining format) * Make pictures of recommended cards, so if vendor changes PCB, there is something to compare against
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