## BOARDS

* UPPER board
  * 0.8mm thickness
  * 8 layers (not for v2 prototype)
  * HDI
  
* LOWER and BoB
  * 0.8mm thickness
  * 6 layers
  * (probably) no HDI

## TRACKS

  * Ordinary (non-power and not necked for BGAs) tracks 
    * 6 mil tracks / 6 mil separation  (around 1.5 mm)
  
## SOLDERING

  * Vapour-phase reflow soldering